The Multidisciplinary Scientific and Technological Research Institute (ICSTM) of Valahia University of Târgoviște is delighted to host SIITME 2026, the 32nd IEEE International Symposium for Design and Technology in Electronics Packaging, from 28 to 31 October 2026. The symposium is organised by the SIITME Steering Committee, in agreement with IEEE and the IEEE Hungary & Romania EPS&NTC Joint Chapter. It is one of Europe's leading meetings on electronics assembly and packaging technologies.
The conference will be held in a hybrid format, with in-person attendance preferred. The programme includes interactive plenary sessions, poster sessions and a technical exhibition. The 5th Summit of IEEE EPS & NTC Student Branch Chapters will take place alongside it. Accepted papers that meet the quality criteria will be submitted for inclusion in IEEE Xplore. The author registration deadline is 15 October 2026. Details and registration at www.siitme.ro. www.siitme.ro.
EVENT INFO :
- Start Date:28 October 2026
- Start Time:09:00
- End Date:31 October 2026
- End Time:14:00
- Number of Participants:150
- Location:ICSTM - Universitatea Valahia din Targoviste
- Website:https://siitme.ro/